[ect-announce-ja] VLSI Test Symposium 2019 論文募集のご案内

Yasuhiro TAKAHASHI yasut @ gifu-u.ac.jp
2018年 8月 2日 (木) 14:33:20 JST


(本内容を重複してお受け取りの場合はご容赦下さい.)
技術者,研究者の皆様

群馬大学の小林春夫先生より,IEEE VLSI Test Symposium 2019の
論文募集案内がございました。皆様,奮ってご投稿下さい。

*****
Subject: VLSI Test Symposium 2019 論文募集のご案内

電子回路研究者各位

お世話になっています。
群馬大学 小林と申します。

VTS2019 Publicity Chair のProf. Alessandro Savino (トリノ工科大学)から
の依頼によりお知らせさせていただきます。

LSIテスト関係のシンポジウム VLSI Test Symposium (VTS) 2019 が米国
カルフォルニア州モントレ市にて2019年4月23日―25日に開催されます。

発表申込締切は2018年10月3日(金)
論文投稿締切は2018年10月12日(金)

詳細は下記案内のWebページをご参照下さい。
皆様の積極的なご投稿/ご参加のご検討をお願い申し上げます。

37th IEEE VLSI Test Symopsium (VTS'19)
April 23-25, 2019 Monterey, CA (USA)
http://www.tttc-vts.org/

<CALL FOR PAPERS>
Scope:
The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel
concepts in testing, reliability and security of microelectronic
circuits and systems.

The VTS Program Committee invites original, unpublished paper
submissions for VTS 2019. Proposals for the innovative practices and
special sessions tracks are also invited. Major topics include, but are
not limited to:

*	Analog/Mixed-Signal/RF Test
*	ATPG & Compression
*	Silicon Debug
*	Automotive Test & Safety
*	Built-In Self-Test (BIST)
*	Defect & Current Based Test
*	Defect/Fault Tolerance
*	Delay & Performance Test
*	Design for Testability (DFT)
*	Design Verification/Validation
*	Dependability and Testing in Approximate Computing
*	Dependability and Testing in Neuromorphic Computing
*	Dependability and Testing in Quantum Computing
*	Embedded System & Board Test
*	Embedded Test Methods
*	Emerging Technologies Test
*	FPGA Test
*	Fault Modeling and Simulation
*	Hardware Security
*	Low-Power IC Test
*	Microsystems/MEMS/Sensors Test
*	Memory Test and Repair
*	On-Line Test & Error Correction
*	Power/Thermal Issues in Test
*	System-on-Chip (SOC) Test
*	Test Standards
*	Test Economics
*	Test of Biomedical Devices
*	Test of High-Speed I/O
*	Test Quality and Reliability
*	Test Resource Partitioning
*	Transients and Soft Errors
*	2.5D, 3D and SiP Test

Submissions:
The VTS Program Committee invites original, unpublished Paper
Submissions for VTS 2019. Paper submissions should be complete
manuscripts, up to "six" pages (inclusive of figures, tables, and
bibliography) in a standard IEEE two-column format; papers exceeding
the page limit will be returned without review. Authors should clearly
explain the significance of the work, highlight novel features, and
describe its current status. On the title page, please include: author
name(s) and affiliation(s), and the mailing address, phone number, and
e-mail address of the contact author. A 50-word abstract and five
keywords identifying the topic area are also required.

Proposals for the Innovative Practices and Special Sessions tracks are
also invited. The innovative practices track highlights cutting-edge
challenges faced by test practitioners, and innovative solutions
employed to address them. Special sessions can include invited
presentations on hot topics, panels, embedded tutorials. Innovative
practices and special session track proposals should include a title,
name and contact information of the session organizer(s), a 150-to-200
word abstract, and a list of prospective participants.

The deadline to submit title, abstract and authors for all types of
submissions is October 5, 2018. The final version of the PDF of the
paper must be uploaded by October 12, 2018.

Detailed instructions for submissions are to be found at the symposium
website http://www.tttc-vts.org. Authors will be notified of the
disposition of their papers by December 9, 2018. A submission will be
considered as commitment that, upon acceptance, the author(s) will
submit a final camera-ready version of the paper by February 10, 2019.
Registration of at least one author by the camera-ready deadline and
presentation of the paper at the symposium are also required for
inclusion of the paper in the published proceedings. In the case of
innovative practices and special sessions, the organizers commit to
submitting a session title, abstract and list of participants for
inclusion in the symposium proceedings.

VTS 2019 will present a Best Paper Award, a Best Special Session Award,
and a Best Innovative Practices Session Award based on the evaluations
of reviewers, attendees, and an invited panel of judges. We also plan
to organize various Student Activities including the TTTC Best Doctoral
Thesis Contest and PhD Poster Forum, details for which will be made
available through the VTS website. The Best Paper of VTS 2019 and the
Best Innovative Practices presentation will be invited to resubmit to
the IEEE Design & Test of Computers where they will undergo a regular,
but expedited, review process.

Key Dates:
Oct 05, 2018 - Submission deadline
Dec 09, 2018 - Notifications
Feb 10, 2019 - Camera ready upload

Committee:
Steering Committee: M. Abadir – Abadir & Associates
                             J. Figueras – UPC
                             A. Ivanov – U. of British Columbia
                             M. Nicolaidis – TIMA Laboratory
                             P. Prinetto – Politecnico di Torino
                             A. Singh – Auburn University
                             P. Varma – Real Intent
                             Y. Zorian – Synopsys

Organizing Committee:
General Chair: Chen-Huang Chiang – Intel Inc. 
Vice-General Co-Chairs: L. Anghel – TIMA Laboratory 
Past Chair: Y. Makris – UT Dallas Montreal
Program Co-Chairs: S. Di Carlo – P. di Torino
                            P. Song – IBM Research
Vice-Program Co-Chairs: M. Tahoori – Karlsruhe Inst. of Tech.
                                    S. Ozev – Arizona State University
Innovative Practices Co-Chairs: P. Sarson – Dialog Semiconductor
                                            J. Carulli – Globalfoundries
Special Sessions Co-Chairs: J. Dworak – Southern Methodist U.
                                       M. Michael – University of Cyprus
Publications: I. Vatajelu (Chair) – TIMA Laboratory
                 G. Di Natale (Member) – LIRMM
Publicity Co-Chairs: A. Savino – Politecnico di Torino


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