[ect-announce-ja] 【ご案内】 CFP IEEE ITC-Asia 2019 (投稿締切1月25日)

[Yasuhiro TAKAHASHI]

(本内容を重複してお受け取りの場合はご容赦下さい。)
技術者，研究者の皆様

群馬大学の小林春夫先生より，IEEE International Test Conference in Asia 2019の
論文募集案内がございました。皆様，奮ってご投稿下さい。

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第 3回 半導体集積回路試験技術に関するアジア国際会議 

2019年9月3-5日　東京電機大学（北千住）にて開催

 

タイトル、アブストラクト投稿　2019年1月25日締め切り

原稿投稿　　　　　　　　　　　2019年2月08日締め切り　　　　

 

The 3rd ITC-Asia (International Test Conference in Asia) will take
place at the Senju Campus of Tokyo Denki University, in Tokyo, Japan,
Sep. 3-5, 2019. We kindly invite you to submit your work to ITC-Asia
2019. The outstanding papers with extension will be invited to ITC-2019.

==================================================================
CALL FOR SUBMISSIONS
The 3rd IEEE International Test Conference in Asia 2019
Location: Senju Campus of Tokyo Denki University, Tokyo, Japan
Date: September 03-05, 2019 
Home Page: http://www.itc-asia.info.hiroshima-cu.ac.jp/2019/ 
Submission Page:
https://easychair.org/account/signin.cgi?key=81567288.yNIxKBjKR9i3sM8s

Key Date: 
    Submission of title and abstract: Jan. 25, 2019.
    Full paper submission deadline: Feb. 8, 2019.
==================================================================

With the test technology facing its grand challenges to ensure the
quality of ICs and electronic systems incorporating more and more
sophisticated manufacturing processes and system integration
technologies in various emerging applications such as Internet of
Things, cloud computing, automotive electronics, etc., global
proliferation and cooperation is increasingly more important.
International Test Conference has been a flagship conference in test
technology since 1970. With an attempt to stimulate more discussion and
interaction between the academia and the industry around the globe, the
1st ITC-Asia was initiated in Taipei in 2017, and the 2nd ITC-Asia was
held with great success in Harbin China in 2018. The 3rd ITC-Asia will
be held in Tokyo Japan in 2019. Attendee can involve themselves in
attractive sessions on the state-of-the-art test technology trend and
several industry topics. We kindly ask your submissions and
participation to ITC-Asia 2019. Outstanding papers with extension will
be invited to ITC 2019.

Topics of Interests include (but are not limited to) the following
topics:
*	Autonomous Testing 
*	Heterogeneous Testing 
*	Reliability and Testing for Approximate/Quantum Computing 
*	Hardware Oriented Security and Thrust 
*	Design Validation and Debug 
*	ATE Design 
*	Analog and Mixed-Signal Test 
*	RF Test 
*	High-Speed I/O Test 
*	Fault Modeling and Simulation 
*	ATPG (Automatic Test Pattern Generation) 
*	Design for Testability 
*	Built-In Self-Test 
*	Delay Test 
*	System-on-Chip Test 
*	Test Compression 
*	Power-Aware and/or Thermal-Aware Test 
*	Memory Test, Diagnosis, and Repair 
*	Fault Diagnosis and Failure Analysis 
*	Yield Analysis and Learning 
*	Safety and Test for Automotive ICs 
*	Test for Internet of Things 
*	Test for Emerging Devices 
*	CPU/GPU Test 
*	MEMS/Sensor Test 
*	Online Test 
*	On-Chip Measurement 
*	SiP, 2.5D, and 3D IC Test 
*	Interconnect Test 
*	Board-Level Testing and Diagnosis 
*	Test Standards 
*	Test Economics 
*	Reliability Issues 
*	Fault Tolerance 
*	Test for Reconfigurable Systems 
*	Software Test and Reliability 
*	Dependable Systems and Networks

Submission:
Regular paper submissions should be made electronically by PDF
manuscripts only, not exceeding 6 pages in IEEE 2-column format
(including abstract, figures, tables, and bibliography). A submission
will be considered evidence that upon acceptance at least one author
will attend the conference to make the presentation. Authors of
accepted papers are also responsible for preparing the final
manuscripts in time to be included in the electronic proceeding.
Conference content will be submitted for inclusion into IEEE Xplore as
well as other Abstracting and Indexing (A&I) databases. At least one
full registration to the conference is required for each accepted paper.

Key Dates:

*	Submission of title and abstract: Jan. 25, 2019. 
*	Paper submission deadline: Feb. 8, 2019. 
*	Notification of acceptance: April 19, 2019. 
*	Camera-ready manuscript: May 31, 2019.

Please do not hesitate to contact the organizers for any
questions/suggestions.

Contact Information:
H. Ichihara and M. Ishida, Program Co-Chairs, 
pc2019 ＠ itc-asia.info.hiroshima-cu.ac.jp

Attached please find the CFP.
Thanks in advance for your contribution.

Best Regards

Senling Wang
Publicity Chair of ITC-Asia 2019.
Senior Assistant Prof. with Ehime University, Japan
wang ＠ cs.ehime-u.ac.jp <mailto:wang ＠ cs.ehime-u.ac.jp>  
+81-899279955
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